Method and apparatus for packaging a semiconductor device

Details Method and apparatus for packaging a semiconductor device Method and apparatus for packaging a semiconductor device

H - Electricity

01

L

H01L 21/52 (2006.01) H01L 21/00 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2044649

ABSTRACT OF DISCLOSURE There is disclosed a method and an apparatus for packaging a semiconductor flip chip in a substrate by face-down bonding in which a coherent light in irradiated to a bonding head and the substrate and the light reflected by the bonding head and the substrate are interferenced with each other. The adjustment of the inclination of the bonding head against the substrate is performed by the observation of the interference fringe caused by the interference between the lights reflected by the bonding head and the substrate.

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