Low application temperature hot melt adhesive composition...

Details Low application temperature hot melt adhesive composition... Low application temperature hot melt adhesive composition...

C - Chemistry, Metallurgy

09

J

C09J 123/08 (2006.01)

Patent

CA 2704960

A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.

L'invention concerne une composition d'adhésif thermofusible qui comprend un premier agent collant qui comprend une résine d'hydrocarbure aromatique modifiée par un phénol, un polymère thermoplastique qui comprend un copolymère d'éthylène et une première cire.

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