H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/52 (2006.01) H01L 23/528 (2006.01) H01L 27/06 (2006.01) H01L 27/10 (2006.01) H01L 27/105 (2006.01) H01L 27/108 (2006.01)
Patent
CA 2162067
Fabrication of a processing device and analog and digital components on a semiconductor chip may be performed simultaneously during the integration of a DRAM on the same chip by selectively applying the materials utilized in the integration of the DRAM and other desired materials onto the chip. The interconnections which may be fabricated during the simultaneous fabrication of these components on the chip provide improved data transfer capabilities on the chip and access to data that may be stored in the DRAM. The integration of multiple components together with a DRAM on a chip, furthermore, provides for the reduction of production and testing costs of a DRAM integrated on a semiconductor chip.
Colbry Brian Wayne
Gupta Arupratan
At&t Corp.
Kirby Eades Gale Baker
LandOfFree
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