Multilayer electronic assembly utilizing a sinterable...

Details Multilayer electronic assembly utilizing a sinterable... Multilayer electronic assembly utilizing a sinterable...

H - Electricity

05

K

H05K 1/02 (2006.01) B23K 35/36 (2006.01) H01B 1/22 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 1/14 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2196024

Electronic assemblies comprising a sinterable composition are disclosed. The composition sinters reactively and/or non-reactively during the lamination cure cycle of the assembly. The composition generally comprises (i) at least one high melting particulate phase material, (ii) at least one low melting material, and (iii) an organic portion comprising a resin and a cross-linking agent.

Assemblages électroniques comprenant une composition frittable. La composition est frittable réactivement et (ou) non réactivement pendant le cycle de durcissement du laminage de l'assemblage. Elle comprend en général (i) au moins un matériau en phase particulaire à point de fusion élevé, (ii) au moins un matériau à point de fusion bas, et (iii) une partie organique comprenant une résine et un réticulant.

Affiliated with

Also associated with

Rating

Multilayer electronic assembly utilizing a sinterable... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer electronic assembly utilizing a sinterable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic assembly utilizing a sinterable... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1418729