Method for producing microencapsulated adhesive and adhesive...

Details Method for producing microencapsulated adhesive and adhesive... Method for producing microencapsulated adhesive and adhesive...

C - Chemistry, Metallurgy

09

J

C09J 9/00 (2006.01) B01J 13/12 (2006.01) B01J 13/14 (2006.01) B65D 27/16 (2006.01)

Patent

CA 2112012

ABSTRACT OF THE DISCLOSURE A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition or an acrylic. The solvent- based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/ formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.

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