Four heated nozzle manifolds interconnected in a common plane

Details Four heated nozzle manifolds interconnected in a common plane Four heated nozzle manifolds interconnected in a common plane

B - Operations, Transporting

29

C

B29C 45/73 (2006.01) B29C 45/27 (2006.01)

Patent

CA 2180602

Multi-cavity injection molding apparatus having four nozzle manifolds mounted in a common plane with a central inlet manifold having two arms extending in opposite directions. The central manifold has a longitudinal axis extending in a first direction through the two arms. Each nozzle manifold is offset from the central manifold in a second direction that is substantially perpendicular to the longitudinal axis. Each nozzle manifold has a locating pin to locate it in a second direction perpendicular to the first direction. The locating pin allows thermal expansion to slide the nozzle manifold in the first direction into a position wherein each branch of the melt passage is aligned with the melt bore through one of the nozzles extending from the nozzle manifold. A pair of the nozzle manifolds are connected on opposite sides of each arm of the central manifold by connector bushings. Each connector bushing is sufficiently slidable to absorb thermal expansion in the second direction which allows the locating pin to be used to locate each nozzle manifold in the second direction. Thus, the combination of the connector bushing and the locating pin allow sufficient movement of the nozzle manifold in both the first and second directions to provide for thermal expansion of the heated manifold relative to the cooled mold.

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