Manufacturing process of integrated circuits in flip-chip...

Details Manufacturing process of integrated circuits in flip-chip... Manufacturing process of integrated circuits in flip-chip...

H - Electricity

01

L

H01L 21/60 (2006.01) H01L 21/288 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2466882

A process for manufacturing integrated circuits in flip-chip technology having contact elements (31) realised on predetermined contact areas (23), comprises the steps of readying electrical connections (30) in such a way as mutually to connect all the contact areas (23) of said integrated circuit (21), galvanically depositing a contact element (31) in correspondence with each of said contact areas (23) and interrupting said electrical connections (30) between the contact areas (23).

La présente invention se rapporte à un procédé de fabrication de circuits intégrés selon une technique de connexion par billes conformément à laquelle des éléments de contact (31) sont formés sur des zones de contact préétablies (23). Ledit procédé comprend les étapes consistant à préparer les connexions électriques (30) de manière à raccorder mutuellement toutes les zones de contact (23) dudit circuit intégré (21), à déposer par voie galvanique un élément de contact (31) en correspondance avec chacune desdites zones de contact (23) et à interrompre lesdites connexions électriques (30) entre les zones de contact (23).

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