H - Electricity – 01 – F
Patent
H - Electricity
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F
H01F 17/04 (2006.01) H01F 10/06 (2006.01) H01F 10/30 (2006.01) H01F 17/00 (2006.01) H01F 19/04 (2006.01) H01F 19/08 (2006.01) H01F 27/245 (2006.01) H01F 41/04 (2006.01) H01L 23/66 (2006.01) H01L 27/00 (2006.01) H01F 15/18 (1990.01)
Patent
CA 2120452
MAGNETIC AND ELECTROMAGNETIC CIRCUIT COMPONENTS HAVING EMBEDDED MAGNETIC MATERIAL IN A HIGH DENSITY INTERCONNECT Abstract A magnetic or electromagnetic circuit component includes an embedded magnetic material (e.g., ferromagnetic) in an HDI structure with alternating dielectric and metal or winding layers. In one embodiment, the ferromagnetic material is situated in a substrate well, or cavity, with or without an adhesive. Alternatively, the ferromagnetic material is co-fired with the ceramic substrate and then machined to achieve a required core shape. An electroplating process is employed to construct the metal layer , such process including differential plating for varying the thickness of metal layers and/or other portions of the circuit. Laser ablation or any other suitable technique is employed to make through-holes for insertion of the posts of a ferromagnetic core plate used to complete a magnetic circuit, if required. Advantageously, a magnetic or electromagnetic component may have a height of less than about 0.1 inch. Furthermore, such magnetic or electromagnetic circuit components allow for very low inductance interconnections between these components and other circuit elements Moreover, in a power supply, for example, not only can the complete power supply be built using HDI technology, but power density is increased at relatively low cost and at a high level of reproducibility.
Daum Wolfgang D.
Korman Charles Steven
Roshen Waseem Ahmed
Company General Electric
Craig Wilson And Company
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