Siloxane-modified epoxy resin composition

Details Siloxane-modified epoxy resin composition Siloxane-modified epoxy resin composition

C - Chemistry, Metallurgy

08

L

400/5318

C08L 63/00 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1154897

Abstract of the Disclosure Compositions containing siloxane-modified epoxy resins, alkoxy functional organopolysiloxane and conventional epoxy curing agents are described which have improved resistance to degradation of electrical properties by boiling water and moisture. The compositions consist essentially of (A) siloxane-modified epoxy resin, (B) alkoxy functional organopolysiloxane such as polymethylmethoxysiloxane and (C) curing agents such as carboxylic acid anhydrides. The compositions because of the improved properties find use as electrical insulation materials.

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