Low application temperature hot melt adhesive

Details Low application temperature hot melt adhesive Low application temperature hot melt adhesive

C - Chemistry, Metallurgy

09

J

C09J 131/04 (2006.01) C09D 191/06 (2006.01) C09J 123/08 (2006.01) C09J 191/06 (2006.01) C08L 23/08 (2006.01) C08L 91/06 (2006.01)

Patent

CA 2325109

A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180°F.

L'invention concerne une composition adhésive chaude à faible tempérapture d'application et son utilisation dans la formation de carton, de caisse ou plateau, contenant entre environ 5 et 60 % en poids d'acétate de vinyle-éthylène avec environ 30 à 50 % en poids de contenu VA et ayant un indice de fusion d'environ 700 à 4 000 dg/min; un agent poisseux; et une cire ayant un point de fusion d'environ 125 à 180 degrés Fahrenheit.

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