Electroless plating method

Details Electroless plating method Electroless plating method

C - Chemistry, Metallurgy

23

C

C23C 18/20 (2006.01) C23C 18/28 (2006.01) C25D 5/56 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2046882

A B S T B A C T This invention relates to a novel electroless plating method which requires no pre-treatment step for the surface-corrosion on the surface to be plated, wherein a metal layer is formed by applying, onto the surface to be plated, a solution of a composition consisting of a styrene type elastomer used generally as a component for the hot melt type adhesive agent, or the styrene type elastomer and a stickiness imparting resin of a molecular structure similar to that of the elastomer; drying the solution as applied; and effecting the electroless plating on the coated film thus obtained, the method being able to substitute the conventional electroless plating as an advance step of the electrolytic plating for synthetic resin. The particular object of the present invention is to utilize the method in the field of the electroless plating for the purpose of preventing the Plating operation from the electromagnetic wave disturbances.

Affiliated with

Also associated with

Rating

Electroless plating method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1443034