Method and apparatus for alignment and bonding

Details Method and apparatus for alignment and bonding Method and apparatus for alignment and bonding

H - Electricity

05

K

H05K 13/04 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2187961

A method and apparatus aligns device components based on an analysis of an image of features of the components to be aligned. The image is analyzed for deviation in component alignment, and a signal, based on the deviation, is sent to a positioning apparatus to adjust the position of the components relative to each other. The image of the components is advantageously a top view which permits measuring deviations in alignment of features on the top surfaces of components. The components are advantageously bonded together after alignment, and the alignment accuracy of the bonded components is checked.

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