Electronic module of extra-thin construction

Details Electronic module of extra-thin construction Electronic module of extra-thin construction

H - Electricity

01

L

H01L 23/28 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2206786

The invention relates to an electronic module having a semiconductor chip mounted on a system support member in a plastic housing. The system support member having outer contacts and lugs projecting beyond the housing, which lugs have engaging and/or positioning contours for cooperating with automated assembly machines.

L'invention est un module électronique comportant une puce de semi-conducteur montée sur un support à l'intérieur d'un boîtier de plastique. Le support est doté de contacts et de broches faisant saillie à l'extérieur du boîtier; ces broches ont une configuration appropriée pour s'adapter aux machines d'assemblage automatisé.

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