Tunable microwave arrangements

H - Electricity – 01 – P

Patent

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Details

H01P 1/203 (2006.01) H01P 5/18 (2006.01) H01P 7/08 (2006.01)

Patent

CA 2550776

The present invention relates to a tunable microwave arrangement (10) comprising a microwave/ integrated circuit device (11) and a substrate (6). It comprises a layered structure disposed between said microwave /integrated circuit device and said substrate (5), said layered structure acting as a ground plane and it comprises at least one regularly or irregularly patterned first metal layer (1), at least one second metal layer (3), at least one tunable ferroelectric film layer (2), whereby said layers are so arranged that the ferroelectric film layers) (2) is/are provided between the/a first metal layer (1) and the/a second metal layer (3).

L'invention porte sur un dispositif (10) à micro-ondes accordable comportant: un circuit intégré à micro-ondes (11); un substrat (6); et une structure stratifiée disposée entre le circuit intégré (11) et le substrat (5) et servant de plan de terre et comportant au moins une première couche métallique à motifs réguliers ou irréguliers (1), au moins une deuxième couche métallique (3), et au moins une couche de film ferroélectrique (2). Lesdites couches sont disposées de manière à ce que la ou les couches ferroélectriques (2) soient placées entre la ou les premières couches métalliques (2), et la ou les deuxièmes couches métalliques (3).

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