Method for film formation

C - Chemistry – Metallurgy – 25 – D

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C25D 15/00 (2006.01) B05D 5/06 (2006.01) B05D 7/00 (2006.01)

Patent

CA 2167658

The present invention provides a method for film formation, which comprises applying onto a sub- strate an electrocoating (A) and an intermediate coating (B) in this order, heat-curing the formed films of the coatings (A) and (B), applying thereon a liquid light color coating (C) which comprises 100 parts by weight of a thermosetting resin composition, 0.1-30 parts by weight of a fine aluminum powder having an average particle diameter of less than 10 µ and 1-200 parts by weight of a titanium oxide pigment and which shows a film hiding power of 25 µ or less and a film elongation ratio of 10-50% at 20 °C , a liquid metallic coating (D) which comprises 100 parts by weight of a thermosetting resin composition and 0.1-20 parts by weight of a metal- lic pigment having an average particle diameter of 3 µ or more and which shows a film hiding power of 50 µ or more and a film elongation ratio of 10% or less at 20 °C , and a clear coating (E) in this order on a wet-on-wet basis, and heating the formed films of the coatings (C), (D) and (E) to crosslink and cure the three films simul- taneously. According to the method, part of the heat- curing steps employed in multilayer film formation can be eliminated and a multilayer film of smaller thickness and improved properties (e.g. improved surface smooth- ness and chipping resistance) can be obtained.

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