Semiconductor chip mounting method and apparatus

Details Semiconductor chip mounting method and apparatus Semiconductor chip mounting method and apparatus

H - Electricity

01

L

H01L 25/00 (2006.01) H01L 21/60 (2006.01) H01L 21/68 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2095171

ABSTRACT OF THE DISCLOSURE The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).

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