Process for coating substrates with metals

Details Process for coating substrates with metals Process for coating substrates with metals

H - Electricity

05

K

H05K 3/42 (2006.01) C25D 5/56 (2006.01) H05K 3/18 (2006.01) C23C 18/16 (2006.01)

Patent

CA 2331757

The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductive polymer layer and subsequently conducting metalization. The electrically conductive polymer layer is doped with a colloidal palladium solution containing tin before the metalization step is carried out, whereby the electrically conductive polymer is poly-3,4-ethylene-dioxythiophene and is brought into contact with a copper(II) salt solution before metalization.

L'invention concerne un procédé pour métalliser des substrats présentant des surfaces polymères, lors de la production de cartes de circuits, notamment de cartes de circuits comportant des orifices microscopiques et des structures fines. Ce procédé consiste à appliquer un couche polymère électroconductrice puis à effectuer la métallisation. La couche polymère électroconductrice est dopée, avant l'étape de métallisation, avec une solution de palladium colloïdale, renfermant de l'étain. Le polymère électroconducteur est du poly-3,4-éthylène-dioxythiophène et est mis en contact avec un solution de sel cuivrique avant la métallisation.

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