Wet-etch process and composition

Details Wet-etch process and composition Wet-etch process and composition

G - Physics

03

F

96/266, 149/12.1

G03F 7/42 (2006.01) C08J 7/12 (2006.01) C09K 13/00 (2006.01) G03F 7/20 (2006.01) G03F 7/26 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2037490

A Wet-etch composition for polyamic acids and partially cured polyamic acids comprising an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

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