Thermally conductive thermoplastics for die-level packaging...

Details Thermally conductive thermoplastics for die-level packaging... Thermally conductive thermoplastics for die-level packaging...

H - Electricity

01

L

H01L 23/34 (2006.01)

Patent

CA 2620851

A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.

Composition et procédé pour l'encapsulation de micro-électronique au niveau de la puce. La composition comprend entre environ 20 % et environ 80 % de matrice thermoplastique de base; entre environ 20 % et environ 70 % de matériau thermoconducteur non métallique de sorte que la composition ait un coefficient d'expansion thermique inférieur à 20 ppm/C et une conductivité thermique supérieure à 1 W/mK. Des techniques de moulage par injection permettent la fusion de la composition et son injection dans une puce contenant la micro-électronique, aux fins d'encapsulation.

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