Solder alloy having decreased fatigue rupture occurring on...

Details Solder alloy having decreased fatigue rupture occurring on... Solder alloy having decreased fatigue rupture occurring on...

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 35/24 (2006.01) C22C 13/00 (2006.01)

Patent

CA 2122376

The fatigue rupture taking place at a soldered joint due to a heat cycle can be alleviated. Effective use of Cu added solder. This solder is basically consisting of 57 to 65% of Sn, 0.1 to 0.5% of Sb, 0.002 to 0.5% of Te and balancing Pb, all in weight. This invention has introduced a solder alloy comprising the base composition with supplement of 0.001 to 0.5% of Ga and/or 0.1 to 0.3 of Cu, all in weight.

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