Process for producing a strong bond between copper layes and...

Details Process for producing a strong bond between copper layes and... Process for producing a strong bond between copper layes and...

C - Chemistry, Metallurgy

23

C

C23C 4/08 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) H01B 5/14 (2006.01) H01B 13/00 (2006.01) H01L 21/48 (2006.01) H05K 3/14 (2006.01)

Patent

CA 2133422

Process for producing a strong bond between copper layers and ceramic The invention relates to a process for producing a strong bond between copper layers, which have been applied by means of thermal spraying of pulverulent copper or copper alloys, and ceramic. Fine copper powder having a mean particle diameter of ~ 20 µm is applied to the ceramic surface by means of thermal spraying.

Divulgation d'un procédé pour produire une forte adhérence entre des couches de cuivre et de la céramique, obtenue au moyen d'une pulvérisation thermique de cuivre ou d'alliages de cuivre pulvérulent sur de la céramique. Une fine poudre de cuivre, ayant une granulométrie moyenne inférieure ou égale à 20 µ, est appliquée sur la surface de céramique au moyen d'une pulvérisation thermique.

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