Insulating and dissipating heat structure of an electronic part

Details Insulating and dissipating heat structure of an electronic part Insulating and dissipating heat structure of an electronic part

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 33/64 (2010.01) H01L 23/46 (2006.01)

Patent

CA 2682594

An insulating and dissipating heat structure of an electronic part includes an electronic component, a heat sink attached to one surface of the electronic component, a housing having a first notch for coupling with the heat sink, and fluid filled in the housing for cooling. The housing is made of an insulating material. The heat sink, the fluid, and the housing of the present invention are able to lower the temperate and dissipate heat. Particularly, the housing has the character of insulation to meet the safety requirements of high power electronic parts, without concerning about electric conduction and leakage.

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