Method to fabricate a mosfet

H - Electricity – 01 – L

Patent

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Details

H01L 21/336 (2006.01) H01L 21/60 (2006.01) H01L 21/762 (2006.01) H01L 21/768 (2006.01) H01L 21/8238 (2006.01) H01L 29/78 (2006.01) H03K 19/094 (2006.01)

Patent

CA 2384004

An extremely simple method to fabricate MOSFET transistors is described including enhancements of the basic concept. A key idea is that two areas of polysilicon (1, 3) can be isolated from each other and used to isolate a third silicon area (5), if the areas of polysilicon are placed from each other at a distance corresponding to the width of two side wall spacers, and then in a common way oxide or nitride spacers are formed. By means of the method described, a device with limited metallizing is manufactured using only one mask layer. Using one additional mask, the method is extended for producing simple CMOS building blocks. As an illustration the layout of the most common CMOS building block, a CMOS inverter, is demonstrated.

L'invention a pour objet un procédé de fabrication extrêmement simple de transistors MOSFET. Ce procédé consiste à isoler l'une de l'autre deux zones de silicium polycristallin (1, 3) et à les utiliser pour isoler une troisième zone de silicium (5) si les zones de silicium polycristallin sont placées l'une de l'autre à une distance correspondant à la largeur des deux éléments d'espacement des parois latérales. Ensuite, des éléments d'espacement d'oxyde ou de nitrure sont formés. Ce procédé permet de fabriquer un dispositif avec une métallisation limitée à l'aide d'une seule couche formant masque. A l'aide d'un masque supplémentaire, ce procédé permet de produire également des blocs fonctionnels CMOS simples. A titre d'illustration, la disposition du bloc fonctionnel CMOS le plus courant, à savoir un inverseur CMOS est représentée.

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