B - Operations – Transporting – 21 – C
Patent
B - Operations, Transporting
21
C
B21C 37/04 (2006.01) B22D 11/00 (2006.01) B22D 11/06 (2006.01) B22D 11/11 (2006.01) B22D 11/113 (2006.01) C22B 15/00 (2006.01)
Patent
CA 2342018
An adhesion-resistant oxygen-free copper roughly drawn wire not being adhered to each other and being mass-produced at low cost is provided. The adhesion-resistant oxygen-free copper roughly drawn wire contains oxygen in concentration of 1 to 10 ppm and hydrogen in concentration of 1 ppm or less and having a gross oxidation film 50 to 500 angstroms in thickness with an oxidation film of Cu2O being present in a part of said gross oxidation film.
Hattori Yoshiaki
Hori Kazumasa
Koshiba Yutaka
Masui Tutomu
Mitsubishi Materials Corporation
Riches Mckenzie & Herbert Llp
LandOfFree
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