Material deposition

Details Material deposition Material deposition

C - Chemistry, Metallurgy

23

C

C23C 16/44 (2006.01) C03B 19/14 (2006.01) C23C 16/453 (2006.01)

Patent

CA 2312725

A method of depositing a material on a substrate comprises the steps of: (a) passing a precursor liquid through an outlet to generate a stream of droplets of the precursor liquid directed towards the substrate; (b) applying an electric field between the outlet and the substrate; and (c) generating a flame between the outlet and the substrate (50) so that the stream of droplets of the precursor liquid from the outlet (60) pass through the flame before reaching the substrate (50).

La présente invention concerne un procédé permettant de déposer un matériau sur un substrat consistant à: (a) faire passer un liquide précurseur à travers un orifice de sortie pour produire à partir de ce liquide un jet de gouttelettes dirigé vers le substrat, (b) appliquer un champ électrique entre l'orifice de sortie et le substrat, et enfin (c) produire une flamme entre l'orifice de sortie et le substrat, de sorte que le jet de gouttelettes du liquide précurseur traversant l'orifice passe par la flamme avant d'arriver au substrat.

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