Vertical removal of excess solder from a circuit substrate

Details Vertical removal of excess solder from a circuit substrate Vertical removal of excess solder from a circuit substrate

B - Operations, Transporting

23

K

B23K 1/00 (2006.01)

Patent

CA 2541977

A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated (66) until it is liquid, wherein the excess solder is wicked (68) vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted (70) from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

La présente invention a trait à un procédé d'élimination verticale de l'excès de soudure d'un substrat de circuit comprenant l'utilisation d'un substrat de circuit sacrificiel (60) avec une pluralité de plages et de trous d'interconnexion qui sont mouillables par la soudure. Les plages et les trous d'interconnexion du substrat de circuit sacrificiel sont disposés (64) à proximité verticale de l'excès de soudure du substrat de circuit. L'excès de soudure est réchauffé (66) jusqu'à ce qu'il soit à l'état liquide, dans lequel il est absorbé par action capillaire (68) à la verticale sur les plages et dans les trous d'interconnexion du substrat de circuit sacrificiel. Ensuite, le substrat de circuit sacrificiel est soulevé (70) de la proximité du substrat de circuit lorsque la soudure est toujours à l'état liquide, retenant l'excès de soudure mais laissant subsister une quantité prédéterminée sur le circuit de substrat.

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