H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) B29C 63/00 (2006.01) B32B 7/06 (2006.01) B32B 15/08 (2006.01) H05K 3/02 (2006.01)
Patent
CA 2489313
An improved method of and apparatus for producing preferably thin plastic protective film layers (2) for thin shiny copper foils (1) and the like, as for PCB applications, with electric charge adhering of the same to the foil (1) and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.
L'invention concerne un procédé et un appareil améliorés permettant de produire de préférence des couches (2) de films en plastique minces de protection de feuilles (1) de cuivre brillantes minces et analogues, notamment pour des applications de cartes à circuit imprimé (PCB), pourvues de charge électrique adhérant auxdites feuilles (1) et pouvant se détacher pour fournir la même surface de feuille de cuivre initiale, brillante et parfaite ne présentant aucune contamination, ni altération, aucun résidu physique, chimique ou autre, en dépit de procédures de manipulation ou d'autres traitements.
Macrae & Co.
Metallized Products Inc.
Wilheim Martin J.
LandOfFree
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