Cooling structures and package modules for semiconductors

Details Cooling structures and package modules for semiconductors Cooling structures and package modules for semiconductors

H - Electricity

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H01L 23/34 (2006.01) H01L 21/50 (2006.01) H01L 21/60 (2006.01) H01L 23/42 (2006.01) H01L 23/433 (2006.01) H01L 31/024 (2006.01) H01L 33/00 (2006.01) H01S 5/024 (2006.01)

Patent

CA 2065980

SZ9-90-016 COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS ABSTRACT Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink. The inventive cooling structure consists of a current/voltage supply level with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge in thermal connection to the heat transfer structure provides for heat flux between the inventive cooling structure and the heat sink.

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