Semiconductor device package

Details Semiconductor device package Semiconductor device package

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/047 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2338931

A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.

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