Dispensing tube for solder paste

B - Operations – Transporting – 05 – C

Patent

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Details

B05C 17/005 (2006.01) B23K 3/06 (2006.01) B65D 83/00 (2006.01) B65D 83/76 (2006.01)

Patent

CA 2063861

DOCKET NO. KES-1408 ABSTRACT A dispensing tube for solder paste is disclosed in which the solder paste is contained in a tube manufactured from a material which is a constituent element of solder. The tube includes a forward end having a dispensing orifice and a rear end through which the tube may be filled with solder paste. After the tube is filled with solder paste the rear end is sealed with a plug manufactured from the same material as which the tube is manufactured. Solder paste is dispensed from the tube by applying pressure to the plug to pushthe plug through the body of the tube, thereby causing solder paste to be squeezed out of the orifice. The tube may be disposed of by melting in a solderpot so that the melted material which comprised the tube may form one of the constituent elements of new solder being manufactured.

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