Method for laying floor panels

E - Fixed Constructions – 04 – F

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E04F 15/02 (2006.01)

Patent

CA 2715964

The invention relates to a method for laying floor panels (1.n, 2.n, ...) in a room to form a closed floor area on a laying plane (E v) without using an adhesive, said floor panels especially consisting of a wood material, such as MDF or HDF, and having matching corresponding profiles on opposite longitudinal edges (I, I') and transverse edges (II, II'). The closed floor area is obtained by interconnecting a plurality of panels (1.1, 1.2, ..., 2.1, 2.2, ...) on their transverse edges (II, II') to give a row (R3) and on their longitudinal edges (I, I') to give a plurality of rows (R n) and then locking them in relation to each other.

La présente invention concerne un procédé d'application de panneaux de sol (1.n, 2.n,...) notamment constitués d'un matériau dérivé du bois tel qu'un panneau MDF ou HDF, qui présentent sur leurs arêtes longitudinales (I, I') et arêtes transversales (II, II') opposées un profil respectivement mutuellement correspondant, dans une pièce, pour former une surface de sol fermée sur un plan d'application (Ev), plusieurs panneaux de sol (1.1, 1.2,..., 2.1, 2.2,...) étant reliés entre eux au niveau de leurs arêtes transversales (II, II') pour former une rangée (R3) et au niveau de leurs arêtes longitudinales (I, I') pour former plusieurs rangées (Rn), et encliquetés les uns dans les autres.

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