Electroplating method for coating a substrate surface with a...

Details Electroplating method for coating a substrate surface with a... Electroplating method for coating a substrate surface with a...

C - Chemistry, Metallurgy

25

D

C25D 5/18 (2006.01) C25D 5/54 (2006.01) H01L 21/288 (2006.01)

Patent

CA 2622918

The invention concerns an electroplating method for coating a substrate surface with copper. The invention is characterized in that said method includes: a step whereby said surface to be coated is contacted without electrical polarization with an electroplating bath; a coat forming step whereby said surface is polarized; a step whereby said surface is separated from the electroplating bath under electrical polarization; said electroplating bath comprising dissolved in a solvent: a source of copper ions, in a concentration of 0.4 to 40 mM; at least one copper complexing agent.

La présente invention a pour objet un procédé de revêtement par électrodéposition d'une surface d'un substrat par du cuivre. Selon l'invention, ce procédé comprend : une étape au cours de laquelle ladite surface à revêtir est mise en contact sans polarisation électrique avec un bain d'électrodéposition ; une étape de formation du revêtement au cours de laquelle ladite surface est polarisée; une étape au cours de laquelle ladite surface est séparée du bain d'électrodéposition sous polarisation électrique ; le bain d'électrodéposition précité comprenant en solution dans un solvant : une source d'ions du cuivre, en une concentration de 0,4 à 40 mM ; au moins un agent complexant du cuivre.

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