C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3080
C08L 51/06 (2006.01) C08L 71/12 (2006.01) C08L 59/00 (2006.01) C08L 61/06 (2006.01) C08L 63/00 (2006.01) C08L 67/00 (2006.01) C08L 69/00 (2006.01) C08L 77/00 (2006.01) C08L 81/02 (2006.01) C08L 81/06 (2006.01) C08L 83/00 (2006.01)
Patent
CA 2012699
ABSTRACT OF THE DISCLOSURE Disclosed herein is a thermoplastic resin composition comprising: (a) polyphenylene ether or a composition containing poly- phenylene ether, (b) (i) a modified propylene polymer obtainable by graft- ing a propylene polymer with a styrene-based monomer alone or in combination with a monomer copolymeriz- able with a styrene-based monomer, or (ii) a composi- tion composed of said modified propylene polymer and a propylene polymer, (c) a rubbery substance, and (d) an inorganic filler having an average particle diame- ter of 0.05-10 µm. Not only does this resin composition exhibit good processability but it also provides molded articles having well-balanced physical properties. - 75 -
Sim & Mcburney
Sumitomo Chemical Co. Ltd.
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