Electrical interconnect contact system

Details Electrical interconnect contact system Electrical interconnect contact system

H - Electricity

01

R

H01R 33/76 (2006.01) G01R 1/04 (2006.01) H05K 7/10 (2006.01)

Patent

CA 2059117

A connecting device for integrated circuits or the like. The disclosed device has a housing interposed between the lead of an integrated circuit and the respective terminal. A slot in the housing extends from one surface of the housing to the oppositely facing second surface. The slots, of which there can be a plurality, extends parallel to the axis of alignment of the lead and the terminal. The first surface has a trough proximate the integrated circuit lead. The second surface has formed therein a similar trough which is near the terminal. The first mentioned trough receives a rigid first element extending across the slot or slots in which one or more contacts are received. The second mentioned trough receives an elastomeric second element. It also extends across the slot or slots. A planar contact or contacts is or are received in the slot or slots. Each contact has a protrusion to be engaged by an integrated circuit lead. The contact also has a nub normally extending outward from the housing toward the second surface of the housing to engage a corresponding spaced terminal. The contact further has a hook near the nub of the contact, which hook encircles the elastomeric second to hold the contact thereto. There is an elongated channel in each contact for receiving the rigid element. Relative movement occurs as the protrusion of the contact is engaged by, and urged inwardly into the housing by, an integrated circuit lead. The assembly functions as a result of the rigid first element moving relatively along the channel formed in the contact. The protrusion of the contact moves across the integrated circuit lead by which it has been engaged. The nub of the contact moves across the corresponding spaced terminal of the printed circuit board. A number of different embodiments is discussed in the disclosure.

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