Method of manufacturing closure panels using thermosetting...

Details Method of manufacturing closure panels using thermosetting... Method of manufacturing closure panels using thermosetting...

B - Operations, Transporting

29

C

B29C 45/14 (2006.01) B32B 7/12 (2006.01)

Patent

CA 2135335

ABSTRACT OF THE DISCLOSURE Methods for forming components through the use of hot melt adhesives are disclosed. Hot melt adhesive are applied to one or more panels and the panels are assembled. Upon curing of the hot melt adhesive the panels become bonded thereby forming the component. Under at least one method the panels are first secured together mechanically then the hot melt adhesive is applied. 24

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