Resin compositions with a low coefficient of thermal...

Details Resin compositions with a low coefficient of thermal... Resin compositions with a low coefficient of thermal...

C - Chemistry, Metallurgy

08

K

C08K 3/04 (2006.01) C08K 7/02 (2006.01)

Patent

CA 2610386

This invention generally relates to resin compositions having a reduced coefficient of thermal expansion. Specifically, this invention relates to resin compositions wherein the lower coefficient of thermal expansion is achieved by addition and mixing of at least one filler material to the resin composition in question. This invention further relates to articles made from such resin compositions having a reduced coefficient of thermal expansion. This invention also relates to a method for making such articles.

L'invention concerne en général des compositions de résine présentant un coefficient de dilatation thermique réduit. De manière spécifique, l'invention concerne des compositions de résine pour lesquelles le faible coefficient de dilatation thermique est obtenu par ajout et mélange d'au moins une matière de remplissage à la composition de résine en question. L'invention concerne également des articles obtenus à partir desdites compositions de résine à faible coefficient de dilatation thermique. L'invention concerne en outre un procédé de fabrication desdits articles.

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