Method and apparatus for the application of powder material...

Details Method and apparatus for the application of powder material... Method and apparatus for the application of powder material...

A - Human Necessities

61

J

A61J 3/00 (2006.01) B05B 5/08 (2006.01)

Patent

CA 2547798

Apparatuses (201) and methods for electrostatically applying a powder material to substrates are described. A plurality of platens (202, 203) are provided, each arranged to hold a plurality of substrates such as solid dosage forms (101, 111). Each platen (202, 203) is driven around an endless path and passes through a loading region (Fig. 3, 4) in which substrates are loaded onto the platens (202, 203), a developing region (Fig. 5, 6) in which the powder material is applied to the substrates, a fusing region (Fig. 7) in which the applied powder material is fused, and an unloading region (Fig. 8) in which substrates are removed from the platens (202, 203).

L'invention concerne des appareils et des procédés qui permettent d'appliquer de manière électrostatique un matériau en poudre sur des substrats. Une pluralité de plaques sont disposées de façon que chacune comporte une pluralité de substrats dans des formes posologiques solides. Chaque plaque est déplacée le long d'un trajet sans fin et traverse une région de chargement dans laquelle les substrats sont chargés sur les plaques, une région de développement dans laquelle le matériau en poudre est appliqué aux substrats, une région de fusion dans lequel le matériau en poudre appliqué est fondu et une région de déchargement dans laquelle les substrats sont retirés des plaques.

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