Method and apparatus for sealing an enclosure

H - Electricity – 02 – G

Patent

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Details

H02G 3/02 (2006.01) H02G 3/14 (2006.01)

Patent

CA 2731610

An apparatus and method according to which a seal is provided between an enclosure and an enclosure cover. The enclosure cover includes an enclosure engagement surface for coupling to enclosure. The apparatus includes a gasket positioned in a gasket channel located on the enclosure engagement surface to provide a seal between the enclosure and the enclosure cover. The enclosure engagement surface also includes a flame path surface adjacent the gasket channel.

La présente invention porte sur un appareil et sur un procédé selon lesquels un joint d'étanchéité est disposé entre un boîtier et un couvercle de boîtier. Le couvercle de boîtier comprend une surface de mise en prise de boîtier pour un couplage au boîtier. L'appareil comprend un joint positionné dans une cannelure de joint située sur la surface de mise en prise de boîtier pour obtenir un joint d'étanchéité entre le boîtier et le couvercle de boîtier. La surface de mise en prise de boîtier comprend également une surface de trajet de flamme adjacente à la cannelure de joint.

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