Nonwoven joint tape having low moisture expansion properties...

Details Nonwoven joint tape having low moisture expansion properties... Nonwoven joint tape having low moisture expansion properties...

C - Chemistry, Metallurgy

09

K

C09K 3/10 (2006.01) C09J 7/04 (2006.01) D04H 13/00 (2006.01) E04F 13/07 (2006.01) E04F 19/00 (2006.01) E04F 21/165 (2006.01)

Patent

CA 2671795

The invention is directed to a joint tape for finishing a joint between boards comprising a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards comprising (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.

L'invention concerne un ruban à joint permettant la finition d'un joint entre des planches, comprenant un substrat non tissé qui ne gonfle sensiblement pas en présence d'eau. L'invention concerne également un procédé de finition de joint entre des planches, consistant : (i) à appliquer le ruban à joint selon l'invention sur un joint entre des planches par enrobage dudit joint dans un premier revêtement de composé de joint; (ii) à appliquer un deuxième revêtement de composés de joint sur le ruban, l'étape (ii) étant réalisée avant que le ruban à joint et le composé de joint appliqués lors de l'étape (i) n'aient sensiblement séchés; et facultativement (iii) à appliquer un troisième revêtement de remplissage ou de finition de composé joint sur le ruban, l'étape (iii) étant réalisée avant que le ruban à joint et le deuxième revêtement n'aient sensiblement séchés.

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