Solder paste formulations for use in the electronics industry

Details Solder paste formulations for use in the electronics industry Solder paste formulations for use in the electronics industry

B - Operations, Transporting

23

K

B23K 35/36 (2006.01) B23K 35/22 (2006.01)

Patent

CA 2125688

A stable solder paste or cream for use in the electronics industry which comprises i)a nonaqueous vehicle and ii) a solder power filler material, characterized in that the vehicle is an emulsion of two or more immiscible organic liquids of at least 60 vol % disperse phase, one of which liquids is a polar organic solvent, or a mixture thereof, and the other of which liquid is an aliphatic hydrocarbon, or a mixture thereof, and in that the solder paste or cream mixture, when reflowed at a temperature in the range of up to 270 °C, yields less than 2.5 wt % organic residues based on the weight of the solder paste or cream.

La présente invention se rapporte à une soudure stable en pâte ou en crème destinée aux applications électroniques et comprenant i) un véhicule non aqueux et ii) un matériau de remplissage pour poudre. La soudure se caractérise par le fait que le véhicule est une émulsion d'au moins deux liquides organiques immiscibles, à phase dispersée d'au moins 60 % en volume, l'un des liquides étant un solvant organique polaire ou un mélange de ces substances, et l'autre liquide étant un hydrocarbure aliphatique ou un mélange de ces substances. Lors de la refusion à une température maximale de 270 degrés C, le mélange de soudure en pâte ou en crème produit des résidus organiques représentant moins de 2,5 % du poids total de la pâte ou crème.

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