H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/56 (2006.01) H01L 21/50 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01L 23/02 (2006.01) H01L 23/06 (2006.01) H01L 23/10 (2006.01) H01L 23/367 (2006.01)
Patent
CA 2066704
2066704 9107776 PCTABS00005 A method for the assembly of an adhesively sealed tape package (50) having base (36) and cover (38) components is provided. An electronic device (32) is first bonded to the inner leads (28) of a tape leadframe (12). The chip on tape (10) is then disposed between the base component (36) and the cover (38) component and adhesively sealed (42, 43) to both. The electronic device (32) and a portion of the inner leads (28) are thereby encapsulated. In one embodiment the base (36) and cover (38) components are an aluminum base alloy having an anodization layer (44) over at least those surfaces exposed to the external environment or the adhesive (42, 43).
Olin Corporation
Swabey Ogilvy Renault
LandOfFree
Method for housing a tape-bonded electronic device and the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for housing a tape-bonded electronic device and the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for housing a tape-bonded electronic device and the... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1606740