Cooling asssembly

Details Cooling asssembly Cooling asssembly

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2611578

In a method for manufacturing a cooling assembly, heat pipes (7) are secured to a circuit board (9) by means of heat sinks (4) that are attached to the circuit board overlying the respective heat pipe or heat pipes, thereby squeezing said heat pipe or heat pipes between the heat sinks and the circuit board.

Dans une méthode de fabrication d~un ensemble de refroidissement, des tuyaux chauds (7) sont fixés à une carte de circuit imprimé (9) au moyen de puits de chaleur (4) attachés à la carte de circuit imprimé recouvrant le tuyau ou les tuyaux chauds respectifs, pressant ainsi ledit tuyau ou lesdits tuyaux chauds entre les puits de chaleur et la carte de circuit imprimé.

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