Method of enclosing a substrate

Details Method of enclosing a substrate Method of enclosing a substrate

B - Operations, Transporting

29

C

B29C 65/66 (2006.01) B29C 61/06 (2006.01) H02G 15/18 (2006.01)

Patent

CA 2072075

2072075 9110355 PCTABS00006 A method of enclosing a substrate within a heat-shrinkable sleeve, which comprises the steps of: (a) attaching to the substrate a slideway; (b) attaching to the slideway a clip having at least two legs; (c) positioning a heat-shrinkable sleeve around the substrate; (d) sliding the clip by means of the slideway and with respect to the substrate such that at least one portion of the sleeve becomes positioned between the legs of the clip, and (e) causing heat-shrinkage of the sleeve.

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