H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H05K 3/24 (2006.01) H05K 3/36 (2006.01)
Patent
CA 2108868
Electric elements such as a resistor chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from: the re-flow method using cream solder, the chip-on-board method using bonding wires, the outer-lead-bonding method, and the thermal-pressing method using heat-seal. The printed circuit board is provided with lands having surface layers of a non-electrolysis Ni-Au plate, a soft Au plate and an electrolysis solder plate, each corresponding to a selected mounting method.
Corporation Nec
G. Ronald Bell & Associates
LandOfFree
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