Substrate for electronic packaging, pin jig fixture

Details Substrate for electronic packaging, pin jig fixture Substrate for electronic packaging, pin jig fixture

H - Electricity

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H01L 23/522 (2006.01) C25D 11/00 (2006.01) C25D 11/04 (2006.01) C25D 11/22 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 3/44 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2290819

A substrate (1, 16, 21, 31) for electronic packaging, the substrate having a discrete, generally prismatoid, initially electrically conductive valve metal solid body with one or more spaced apart, original valve metal filled vias (6, 19, 28, 32) each individually electrically isolated by a porous oxidized body portion therearound. A pin jig fixture (41) for mechanically masking a metal surface, the pin jig fixture (41) having an anodization resistant bed of pins (42) each pin (43) having a leading end surface (44) for intimate juxtaposition against a metal surface to masks portions thereof.

L'invention concerne un substrat (1, 16, 21, 31) d'encapsulation de composants électroniques, le substrat présentant un corps solide discret, d'une manière générale prismatoïde, en métal de valve initialement électroconducteur et présentant un ou plusieurs trous d'interconnexion (6, 19, 28, 32) espacés remplis d'un métal de valve original, chacun isolé électriquement et individuellement par une partie de corps oxydé poreux périphérique. L'invention concerne également un gabarit (41) de montage à broches destiné à masquer mécaniquement une surface en métal, le gabarit (41) de montage à broches présentant un lit de broches (42) résistant à l'anodisation, chaque broche (43) présentant une surface terminale avant (44) destinée à venir en juxtaposition étroite contre une surface en métal afin d'en masquer certaines parties.

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