Advance multilayer molded plastic package using mesic...

Details Advance multilayer molded plastic package using mesic... Advance multilayer molded plastic package using mesic...

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 21/84 (2006.01) H01L 23/495 (2006.01) H01L 23/64 (2006.01) H01L 23/66 (2006.01) H01L 29/44 (1990.01) H01L 29/48 (1990.01) H01L 29/60 (1990.01)

Patent

CA 2108542

ABSTRACT OF THE DISCLOSURE A method and resulting structure for constructing an IC package. The package has a bottom conductive plate that has a layer of insulative material thereupon in a predetermined pattern. Adjacent to the insulative layer is a layer of conductive metal thereupon. The layer of metal can be laid down onto the insulative layer in a predetermined pattern to create a power plane, a plurality of signal lines, or a combination of power planes and signal lines. On top of the layer of conductive material is a lead frame which may be separated by a second layer of insulative material. The second layer of insulative material has a plurality of holes filled with a conductive material, which electrically couple the layer of conductive material with the leads of the lead frame. The power and ground pads of the integrated circuit are connected to the layer of conductive material and conductive plate, which are also coupled to the corresponding leads of the lead frame, thereby connecting the IC to the leads of the lead frame. The signal pads of the IC are connected to the lead frame and/or signal lines formed within the layer of conductive material. The IC and attached circuit package can then be encapsulated in a plastic shell.

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