Single atmosphere for firing copper compatible thick film...

Details Single atmosphere for firing copper compatible thick film... Single atmosphere for firing copper compatible thick film...

H - Electricity

05

K

356/6

H05K 3/00 (2006.01) H01L 21/48 (2006.01) H01L 21/70 (2006.01)

Patent

CA 2007199

ABSTRACT OF THE DISCLOSURE A SINGLE ATMOSPHERE FOR FIRING COPPER COMPATIBLE THICK The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate applying the paste to the substrate by a conventional technique such as screen printing, drying the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment the substrate is fired in an ambient comprising only carbon dioxide.

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