Metal pin grid array package

Details Metal pin grid array package Metal pin grid array package

H - Electricity

01

L

H01L 23/12 (2006.01) H01L 23/02 (2006.01) H01L 23/055 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2067384

2067384 9108587 PCTABS00005 A metal pin grid array package (50) and a process for the assembly of the package (50) is provided. The package (50) includes a metal or metal alloy base component (12) having an ordered array of holes (35). Terminal pins (30) are electrically interconnected to a desired circuit (14) and extend through the ordered array of holes (35). A dielectric polymer sealant (52) bonds a cover component (36) to both the circuit (14) and to the base component (12). During package (50) assembly, the polymer sealant (52) flows into the holes comprising the ordered array of holes (35) electrically isolating the terminal pins (30) from the base component (12).

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