B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 45/14 (2006.01) B29C 45/00 (2006.01) B29C 45/02 (2006.01) B29C 67/24 (2006.01) B29D 11/00 (2006.01) C08K 3/36 (2006.01) C08K 7/02 (2006.01) C08L 101/00 (2006.01) G02B 6/36 (2006.01) G02B 6/38 (2006.01)
Patent
CA 2113788
A resin composition and a method for molding an optical connector ferrule which displays an improvement in melting viscosity and fluidity. The method involves forming a fixing pin insert hole and an optical fiber insert hole within a cavity with a forming pin, injecting a resin composition into said cavity by transfer molding, and hardening the resin composition. The melting viscosity of the resin composition is from 50 poise to 500 poise as the resin composition is injected into the cavity. The resin composition includes a base resin and a silica powder filler, wherein the silica powder filler constitutes from 75 wt% to 90 wt% of the resin composition, and wherein the silica powder filler has a particle size distribution with a maximum diameter of 100 µm or less and a peak value from 10 µm to 20 µm.
Honjo Makoto
Yamanishi Toru
Riches Mckenzie & Herbert Llp
Sumitomo Electric Industries Ltd.
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