Electroless plating-resisting ink composition

Details Electroless plating-resisting ink composition Electroless plating-resisting ink composition

C - Chemistry, Metallurgy

09

D

400/7921

C09D 11/00 (2006.01) C08L 63/00 (2006.01) C08L 63/02 (2006.01) C08L 63/04 (2006.01) G03F 7/028 (2006.01) H05K 3/18 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2027424

ELECTROLESS PLATING-RESISTING INK COMPOSITION ABSTRACT A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.

Affiliated with

Also associated with

Rating

Electroless plating-resisting ink composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating-resisting ink composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating-resisting ink composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1637682